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sendes om 4-5 virkedager
Produktkode: HTK-002-U1-GP
Cooler Master HTK-002 substans for kjøleribbe Termisk pasta 4,5 W/m·K
- Suitable for CPU, chipsets on Mainboard, VGA card, etc
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket types
- Produces an even layer when using applicator
- Dielectric
- Wide range of application temperature
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.